Manufacturing process of a high efficiency heat dissipating device

ABSTRACT

A manufacturing process of a high efficiency heat dissipating device includes a plate or cylinder base, and a plurality of fins assembled to the base. The base and the fins are made of aluminum. An oxide layer to improve heat radiating are formed to surface of the base or the fins by an anodizing process. A heat pipe is additionally arranged to conduct the heat from the base to the fins. Or, in a heat dissipating device consists of the heat pipe and the fins, oxide layers are formed to the surfaces of the fins by the anodizing process. By the above structure, a heat radiating effect is improved and a visible appearance, an anti-pollution ability are formed to the heat dissipating device.

FIELD OF THE PRESENT INVENTION

The present invention relates to manufacturing process of a highefficiency heat dissipating device, and particular to a heat dissipatingdevice applied to a computer or an electronic component. By an anodizingprocess, a heat radiating effect is improved as well as an outer visibleappearance and an anti-pollution ability.

DESCRIPTION OF THE PRIOR ART

A prior heat dissipating device for a computer or electronic componentconsists of a base attached to a heat source and fins assembled to thebase, or further consists of a heat pipe connected to the base and thefins so as to conduct the heat from the base to the fins by directly orindirectly contact to the heat source. To improve a heat dissipation,heat dissipating device vendors spend lots of effort on components andstructure of the heat dissipating device. The thermal conduction througha material is defined in the following formula:

Q=−KA*ΔT/ΔX

The Q is heat flow, the K is a thermal conductivity, the A is a crosssection area of conducting surface, the ΔT is temperature difference,and the ΔX is conducting distance between the two temperatures.Therefore, more fins are assembled to the base, more area are added toradiate thermal energy. By changing the material of the base or the finsto aluminum or copper, the higher thermal conductivity thereof will alsohelp. Moreover, by arranging a fan beside the heat dissipating device tolower the temperature of the fins will also raise the temperaturedifference so as to raise the heat flow.

However, by increasing the fins or air flow by the fan to raise the heatflow will meet a limit. That means the heat flow is limited for a heatdissipating device with a specification within a certain interval. Theoperating frequency of the computer and the electronic component aregetting fast, and more heat generated usually exceed heat dissipatingdevice's limit. The operation temperature of the computer and electroniccomponent become higher so that the function and lifetime are damaged.Some vendors use water-cooling system or Thermo-Electric Heatdissipating device (TEC) to overcome the problem, but the water-coolingsystem is large-scaling, high cost, and having a water condensing andleakage problem. The TEC is a semiconductor-base heat dissipatingdevice. In accordance with the Peltier Effect, heat energy will beconducted from a heat absorbing end of the TEC to another end which is aheat dissipating end. According to the First Law ofThermodynamics-Conservation of Energy, the heat energy is onlytransferred to another side of the TEC for dissipating by another heatdissipating device. Thus, the heat dissipating effect is not good andalso the cost is high. The higher operating temperature of theelectronic component caused by the TEC will further lower thetemperature difference and the heat flow as well.

SUMMARY OF THE PRESENT INVENTION

Accordingly, the primary object of the present invention is to provide amanufacturing process of a high efficiency heat dissipating device.Without changing the specification of the heat dissipating device orusing auxiliary water-cooling system or TEC, the heat conduction will beimproved for meeting the needs of higher efficiency and heat-generatingdevices.

A secondary object of the present invention is to provide amanufacturing process of forming an oxide layer to a surface of the heatdissipating device by an anodizing process so that the heat dissipatingdevice is durable, antioxidative, anti-polluted, and colorful.

To achieve above objects, the present invention provides the oxide layerto surfaces of the base and/or the fins by the anodizing process. Theoxide layer has a higher energy radiating effect so that the heat iseasier to be dissipated. After the temperature of the heat dissipatingdevice is lowered, a temperature difference will improve the heatconduction from the heat source to the heat dissipating device. By thetemperature gradient and interaction between, the contact temperature ofthe heat dissipating device will be lowered and the heat will beefficiently dissipated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a pictorial drawing of a heat dissipating device assembled bya base and fins according to the present invention.

FIG. 2 is a manufacturing flow chart of an embodiment of the presentinvention.

FIG. 2A is another manufacturing flow chart of an embodiment of thepresent invention.

FIG. 2B is one another manufacturing flow chart of an embodiment of thepresent invention.

FIG. 3 is one another manufacturing flow chart of an embodiment of thepresent invention.

FIG. 4 is a pictorial drawing showing an embodiment with heat pipe ofthe present invention.

FIG. 5 is a pictorial drawing showing another embodiment with heat pipeof the present invention.

FIG. 6 is a schematic view showing an oxide layer formed to surfaces ofthe base and the fin.

FIG. 7 is an exploded view of an embodiment of the present invention.

FIG. 8 is an assembly drawing of an embodiment of the present inventionshown in FIG. 7.

FIG. 9 is an exploded view of another embodiment of the presentinvention.

FIG. 10 is an assembly drawing of another embodiment of the presentinvention shown in FIG. 9.

DETAILED DESCRIPTION OF THE INVENTION

In order that those skilled in the art can further understand thepresent invention, a description will be provided in the following indetails. However, these descriptions and the appended drawings are onlyused to cause those skilled in the art to understand the objects,features, and characteristics of the present invention, but not to beused to confine the scope and spirit of the present invention defined inthe appended claims.

A manufacturing process of a high efficiency heat dissipating device isillustrated in FIG. 1. The heat dissipating device 10 includes a base20, the base 20 has a side of a shape of a rectangle, a circle, ageometrical shape, or irregular shape contacted to a heat source. Theheat source is not confined to integrated circuits, chips, or LightEmitting Diode modules. Another side of the base 20 is tightly combinedwith a plurality of fins 30 by welding, pressing, or heat pipe gluing.Heat from the heat source is thus conducted to the fins 30 fordissipating. The present invention has a main object which is to raise aunit heat radiation rate of the heat dissipating device 10.

In accordance with the Stefan-Boltzmann Law, a total energy radiated perunit surface area of a black body is proportional to the black body'sabsolute temperature:

Qb=AσT⁴.

The A is surface area, and the σ is the Stefan-Boltzmann constant. Qb isthe total energy radiated from the black body. However, the emissivityof a material is the ratio of energy radiated of the material to that ofa black body:

ε=Q/A/(Q/A)b

The Q/A is a total energy radiated per unit surface area of thematerial, while the (Q/A)b is a total energy radiated per unit surfacearea of a black body under the same temperature. A black body would havean ε=1, while any other material would have an ε<1. Therefore, aNon-black body would have a energy radiated Q=σAεT⁴. To improve theenergy radiating effect of a material, increasing a surface area A orchanging the σ can be done.

The present invention is to anodize one or both of the aluminum base 20and fins 30 so as to form aluminum oxide layers to the surfaces thereof(referring to FIGS. 2, 3, and 6). The σ of a polished aluminum is 0.04,while the σ of the aluminum oxide is 0.8. Obviously, in accordance ofthe energy radiated formula mentioned above, the base 20 and fins 30with the aluminum oxide surface will have a better energy dissipatingeffect.

Furthermore, by adjusting the voltages and processing time of theanodizing process of the base 20 and the fins 30, different color andthickness of oxide layer 40 can be controllable formed to the base 20and the fins 30 so as to form a visible appearance thereto and ananti-pollution ability.

Moreover, the anodizing and assembling of the base 20, fins 30 of thepresent invention can be performed by the following orders. One is toanodize the base 20 and the fins 30 separately to form high energyradiating oxide layers 40 onto surfaces thereof (referring to FIGS. 2,2A, and 2B), and then to tightly combine the base 20 and the fins 30 asa finished heat dissipating device 10. The other way (referring to FIG.3) is to combine the base 20 and the fins 30 as a heat dissipatingdevice 10 first, and then to anodize the heat dissipating device 10 toform oxide layers 40 onto surfaces of the base 20 and the fins 30 toincrease the energy radiating effect.

Referring to FIG. 4, a heat pipe 50 is tightly arranged to the base 20with one end of the heat pipe 50 and another end thereof to the fins 30to improve the heat conduction. Also, high energy radiating oxide layers40 are formed onto surfaces of the base 20, fins 30 and selectively ontoa surface of the heat pipe 50 by the anodizing process.

Another embodiment of the heat dissipating device of the presentinvention having at least one heat pipe 50 is illustrated in FIG. 5. Oneend of the at least one heat pipe 50 is arranged to a plurality of fins30 and another end thereof is arranged to a base 20, or directlyattached to a heat source 60. Oxide layers 40 of aluminum oxide areformed onto surfaces of the fins 30 and the heat pipe 50 to improve theenergy radiating effect. By adjusting the voltages and processing timeof the anodizing process, different color and thickness of oxide layer40 can be formed to the fins 30.

Therefore, according to the present invention, the base 20, fins 30, andthe heat pipe 50 are applied to a heat dissipating device by the needs.By the anodizing process, oxide layers 40 are formed to the surfaces (asshown in FIG. 6). By adjusting the voltages and processing time of theanodizing process, different color and thickness of oxide layer 40 canbe formed so as to form a visible appearance thereto and ananti-pollution ability. After the temperature of the heat dissipatingdevice 10 is lowered, a temperature difference will improve the heatconduction from the heat source to the heat dissipating device 10. Bythe temperature gradient and interaction between, the contacttemperature of the heat dissipating device 10 will be lowered and theheat will be efficiently dissipated.

With reference to FIGS. 7 and 8, an exploded drawing and an assemblydrawing of another embodiment of the present invention are illustrated.A heat dissipating device 10 a have a cylindrical base 20 a and aplurality of fins 30 a assembled to an outer surface of the cylindricalbase 20 a. The base 20 a and/or the fins 30 a are made of aluminum. Bythe anodizing process, high energy radiating oxide layers 40 a areformed to the surfaces of the base 20 a and/or the fins 30 a. Byadjusting the voltages and processing time of the anodizing process,color and thickness of oxide layer 40 a can be adjusted.

The assembling of the base 20 a, fins 30 a of the present invention canbe performed by the following orders. One is to anodize the base 20 aand/or the fins 30 a separately to form high energy radiating oxidelayers 40 a onto surfaces thereof, and then to tightly combine the base20 a and the fins 30 a as a finished heat dissipating device 10 a by acombining process. The other way is to combine the base 20 a and thefins 30 a as a heat dissipating device 10 a first, and then to anodizethe heat dissipating device 10 a to form oxide layers 40 a onto surfacesof the base 20 a and the fins 30 a to increase the energy radiatingeffect.

Additionally, a carrier 70 a is arranged to an end or an inside of thebase 20 a for being installed by a heat source. By the anodizingprocess, the high energy radiating oxide layer 40 a is formed to asurface of the carrier 70 a to improve the energy radiating effect.

With reference to FIGS. 9, and 10, an exploded drawing and an assemblydrawing of one another embodiment of the present invention areillustrated. A heat dissipating device 10 c have a cylindrical base 20 cand a plurality of fins 30 c assembled to an outer surface of thecylindrical base 20 c. The base 20 c and the fins 30 c are integral madeof aluminum. By the anodizing process, high energy radiating oxidelayers 40 c are formed to the surfaces of the base 20 c and/or the fins30 c. Additionally, a carrier 70 c is arranged to an end or an inside ofthe base 20 c for being installed by a heat source. By the anodizingprocess, the high energy radiating oxide layer 40 c is formed to asurface of the carrier 70 c to improve the energy radiating effect.

The present invention is thus described, it will be obvious that thesame may be varied in many ways. Such variations are not to be regardedas a departure from the spirit and scope of the present invention, andall such modifications as would be obvious to one skilled in the art areintended to be included within the scope of the following claims.

1. A manufacturing process of a high efficiency heat dissipating device comprising the step of assembling a plurality of fins to a base; performing an anodizing process, an oxide layer for improving a heat radiating effect being formed to a surface of at least one of the base or the fins.
 2. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 1, wherein at least one of the base and the fins are made of aluminum; an aluminum oxide layer is formed to the surface of at least one of the base and the fins by the anodizing process to improve the heat radiating effect.
 3. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein colors and thicknesses of the oxide layer of the base and the fins are controllable by adjusting voltages and process time of the anodizing process.
 4. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein at least one of the base and the fins is anodized separately to form the high heat radiating oxide layer onto the surface thereof; and then tightly combining the base and the fins together as a finished heat dissipating device by a combining process.
 5. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein the base and the fins are combined together as a heat dissipating device firstly, and then the heat dissipating device is anodized to form oxide layers onto surfaces of the base and the fins.
 6. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, comprising the step of arranging one end of at least one heat pipe tightly to the base, and another end thereof is arranged to the fins; oxide layers are formed to the surfaces of the base and the fins by the anodizing process to improve the heat radiating effect.
 7. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 6, wherein an oxide layer is formed to a surface of the heat pipe by the anodizing process.
 8. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 2, wherein the base is a plate body with a shape of one of a rectangle, a circle, a geometrical shape, and an irregular shape.
 9. A manufacturing process of a high efficiency heat dissipating device comprising steps of: assembling a plurality of fins assembled to at least one heat pipe; by an anodizing process, an oxide layer for improving a heat radiating effect being formed to a surface of at least one of the heat pipe and the fins.
 10. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 9, wherein the fins is made of aluminum; the oxide layer of aluminum oxide is formed to the surfaces of the fins to improve the heat radiating effect.
 11. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 10, wherein color and thickness of the oxide layer of the fins are controllable by adjusting voltages and process time of the anodizing process.
 12. A manufacturing process of a high efficiency heat dissipating device comprising the steps of assembling a plurality of fins assembled to an outer surface of a cylindrical base; and by an anodizing process, an oxide layer being formed to a surface of at least one of the base and the fins to improve a heat radiating effect.
 13. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 12, wherein at least one of the base and the fins are made of aluminum; by the anodizing process, the oxide layer of aluminum oxide are formed to the surface of at least one of the base and the fins to improve the heat radiating effect.
 14. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein colors and thickness of the oxide layer of at least one of the base and the fins are controllable by adjusting voltages and process time of the anodizing process.
 15. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein the oxide layer is formed to the surface of at least one of the cylindrical base and fins to improve the heat radiating effect; and then the base and the fins are tightly combined together by a combining process.
 16. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein the base and the fins are tightly combined together to be as a heat dissipating device by a combining process; by anodizing the heat dissipating device, oxide layers are formed to the base and the fins.
 17. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein a carrier is arranged to one of an end or an inside of the base for being installed by a heat source.
 18. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 17, wherein the oxide layer is formed to a surface of the carrier by the anodizing process to improve the heat radiating effect.
 19. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 13, wherein the base and the fins being formed integrally; the oxide layer is formed to at least one of the base and the fins by the anodizing process to improve the heat radiating effect.
 20. The manufacturing process of a high efficiency heat dissipating device as claimed in claim 19, wherein a carrier is arranged to one of an end or an inside of the base for being installed by a heat source. 